Andrei Shkel
Editor-in-Chief
Submission-to-ePublication = 4.8 weeks, median
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(Editor-in-Chief: Chief Name)
Submission-to-ePublication = 4.8 weeks, median
Andrei Shkel
Editor-in-Chief
University of California, Irvine, USA
Deepak Uttamchandani
Associate Editor-in-Chief
Strathclyde University, Glasgow, UK
Francisco Falcone
Associate Editor-in-Chief
Univ. Publica de Navarra, Spain
Thilo Sauter
Associate Editor-in-Chief
TU Wien and Danube University, Krems, Austria
Founding Editor-in-Chief
Srinivas Tadigadapa
Founding Editor-in-Chief (2017-2022)
Northeastern University, USA
Editorial Team
Doruk Senka
Associate Editor
Reality Labs, Meta, USA
Chia-Chan Chang
Associate Editor
National Chung-Cheng University, Taiwan
Karthik Shankar
Associate Editor
University of Alberta, Edmonton, Canada
Sheng-Shian Li
Associate Editor
National Tsing Hua University, Taiwan
Saakshi Dhanekar
Associate Editor
Indian Institute of Technology, Jodhpur, India
Troy Olsson
Wireless Sensors Topical Editor
University of Pennsylvania, USA
Giacomo Langfelder
Physical Sensors Topical Editor
Politecnico de Milano, Italy
Sarah Ostadabbas
Associate Editor
Northeastern University, USA
Ian Papautsky
Associate Editor
University of Illinois, Chicago, USA
Sri-Rajasekhar Kothapalli
Associate Editor
The Pennsylvania State University, USA
Dimitrie C. Popescu
Associate Editor
Old Dominion University, Norfolk, VA
Huikai Xie
Optical Sensors Topical Editor
Beijing Institute of Technology, China
Fabien Josse
Associate Editor
Marquette University, Milwaukee, USA
Jesus Corres
Associate Editor
Public University of Navarra, Pamplona, Spain
Xuewen Shu
Associate Editor
Huazhong University of Science and Technology, China
Yuji Suzuki
Sensor Power and Energy Harvesting Topical Editor
Univ of Tokyo, Japan
Christian Zorman
Chemical and Biosensors Topical Editor
Case Western Reserve Univ., USA
Filippo Costa
Associate Editor
Universita di Pisa, Italy
Rolland Vida
Associate Editor
Budapest University of Technology and Economics, Hungary
Matteo Rinaldi
Associate Editor
Northeastern University, Boston, USA
Flavio Esposito
Associate Editor
University of Naples, Italy
Mahendra Kumar Shukla
Associate Editor
ABV- Indian Institute of Information Technology and Management, India
Hamza Shakeel
Associate Editor
School of Electronics, Electrical Engineering and Computer Science Queen’s University, Belfast, UK
Mitradip Bhattacharjee
Associate Editor
Indian Institute of Science Education and Research Bhopal (IISERB), Bhopal, India
Cristiano Marra
Associate Editor
TDK InvenSense, Milan, Italy
Oliver Ozioko
Associate Editor
University of Derby, UK
Behraad Bahreyni
Associate Editor
Simon Fraser University, Canada
Sharmistha Bhadra
Associate Editor
McGill University, Montreal, Canada
Yung C. Liang
Associate Editor
National University of Singapore
Ravibabu Mulaveesala
Associate Editor
Indian Institute of Technology Delhi, India
He Kong
Associate Editor
Southern University of Science and Technology, Shenzhen, China
Jasmina Terre
Associate Editor
Universitat Politècnica de Catalunya. Dept. Mechanical Engineering
Ying Zhang
Associate Editor
Nanjing University of Science and Technology, China
Jeronimo Segovia
Associate Editor
Texas Instruments, Kilby Labs, Santa Clara, USA
Carlo Massaroni
Associate Editor
Università Campus Bio-Medico di Roma, Italy
IEEE Publishing Operations
Leigh Ann Kattenhorn
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